Position:China vacuum equipment network>Patent Literature>Tear open the method that installs semiconductor vacuumize equipment
Tear open the method that installs semiconductor vacuumize equipment
From;  Author:Stand originally
[renown Say]
Tear open the method that installs semiconductor vacuumize equipment
[patent date]
200510126391
[public order]
[application day]
On December 8, 2005
[open day]
On March 28, 2007
[international classifies date]
[the category classifies date]
B25B27/14
[application (patent) ]
Research center of technology of equipment of base of Beijing northward microelectronics is finite liability company
[inventor]
Hu Qian
[the ground Location]
Bridge of winebibber of area of Beijing rising sun east road 1
[international is announced]
[promulgate card day]
[acting orgnaization]
Limited company of representative of Beijing Lu Hao intellectual property
[procuratorial]
Cai Shiying
[pick Want]
This invention involves a kind of method that dismantles equipment of outfit semiconductor vacuumize, include: The slip part that prop up is installed in equipment support upper beam; Slip part is installed on bleed antrum; Tearing open the beam that as identical as equipment support upper beam height installs on outfit car, secure on crossbeam with the slip component of same type propping up on equipment; The butt joint dismantles the slip part propping up on the slip part propping up that assembles a car and equipment; Disconnect the close solid connection of bleed antrum and reaction antrum; Drive bleed antrum with slip component, place pump of a powerful person, element to slide from the slip component propping up of equipment to the slip part propping up that dismantles outfit car; Drive the bleed antrum, slip part propping up that places pump of a powerful person, element to slide from the slip part propping up that dismantles outfit car to equipment with slip component; Secure the close solid link of bleed antrum and reaction antrum; Dismantle the slip part propping up on the slip part propping up that assembles a car and equipment apart. This invention offers dismantle outfit method structure simple, economic equipment and working space and tear open outfit is simple convenient.

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